Shalaby RM. Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys. JAP [Internet]. 2015 May 21 [cited 2025 Aug. 14];9(1):2287-98. Available from: https://www.rajpub.com/index.php/jap/article/view/1469