Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders. JAP [Internet]. 2018 Sept. 25 [cited 2026 Oct. 5];14(3):5835-50. Available from: https://www.rajpub.com/index.php/jap/article/view/7834