YASSIN, A. M.; KHALIFA, B. A. E. H.; ISMAIL, R. A. Structure analysis and enhancement of creep resistance and thermal properties of eutectic Sn-Ag lead free solder alloy by Ti and Cd - addition. JOURNAL OF ADVANCES IN PHYSICS, [S. l.], v. 13, n. 8, p. 5092–5099, 2017. DOI: 10.24297/jap.v13i8.6357. Disponível em: https://www.rajpub.com/index.php/jap/article/view/6357. Acesso em: 20 may. 2024.